Part number:		cat5-tdr r1703
	
General fabrication notes

	* Boards are be individually routed.
	* Substrate is FR4 suitable for lead-free reflow.
	* Lot number / date codes should be placed on the back side of the board.
	* Blue LPI solder mask on both sides of board. All vias to be tented.
	* White LPI legend on both sides of board.
	* Pad finish is ENIG.
	* Finished board thickness is 1.6 mm.
	* Electrical testing requested.
	* Soldermask apertures over differential pairs are test points, to be left intact
		
Impedances

	Control to within 10%.

	Layer 1 microstrip (ref to layer 2 ground)
		140 μm tracks / 125 μm space = 100 ohm differential

	Layer 4 microstrip (ref to layer 3 power plane)
		140 μm tracks / 125 μm space = 100 ohm differential
		
Suggested stackup
	1	35 μm (1 oz) copper			Signal
		180 μm prepreg
	2	18 μm (0.5 oz) copper		Ground
		Core as needed for 1.6mm finished thickness
	3	18 μm (0.5 oz) copper		Power
		180 μm prepreg
	4	35 μm (1 oz) copper			Signal

File naming
	cat5-tdr.d356				IPC D-356 electrical test netlist
	cat5-tdr-Edge_Cuts.gbr		Board outline
	cat5-tdr.drl				Through-board plated holes
	cat5-tdr-NPTH.drl			Through-board unplated holes
	cat5-tdr-F_Paste.gbr		Front solder paste
	cat5-tdr-F_SilkS.gbr		Front silkscreen
	cat5-tdr-F_Mask.gbr			Front solder mask
	cat5-tdr-F_Cu.gbr			Layer 1 copper
	cat5-tdr-In1_Cu.gbr			Layer 2 copper
	cat5-tdr-In2_Cu.gbr			Layer 3 copper
	cat5-tdr-B_Cu.gbr			Layer 4 copper
	cat5-tdr-B_Mask.gbr			Back solder mask
	cat5-tdr-B_SilkS.gbr		Back silkscreen
	cat5-tdr-B_Paste.gbr		Back solder paste